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Quick Details

  • Place of Origin: Hunan, China (Mainland)
  • Brand Name: SAP
  • Model Number: 6A2 6A2DBL DBL6A2
  • Shape: Cup-Shaped
  • Abrasive: Diamond
  • Bonding Agent: metal-ceramic bond
  • Hardness: Medium
  • Viscosity: Proper
  • Size: customize
  • Application: for sapphire substrate ,zirconia ceramic chips grinding and polishing
  • Usage: grinding and polishing
  • Type: Double Row double ring
  • Certificate: ISO9001,SGS,ROHS
  • Bond: Metal-ceramic bond
  • Abarasive material: SDC Diamond
  • Material: Aluminum Oxide
  • Name: 6A2 Doubld row Special Diamond Grinding Wheel

Packaging & Delivery

Packaging Details Each wheel will be packed in a cardboard box with anti-shock bubble. Package is suitable for sea and air transportation.There are free oil stone for dressing the wheels,the technical cards for reference.
Delivery Time Within 5 working days after payment


Double row diamond grinding wheel,diamond abrasive dics,for sapphire,zirconia ceramics reducing thickness

Product Name: Double row Diamond grinding wheel,

Shape :6A2 ,DBL6A2

Abrasive: Diamond ,CBN ,Cubic boron nitride
Grit : D46-D64,D54, 800# ,1000#,1200# 12000#

SIze: 200-400mm diameter

Substrate: Aluminun

Bond:Metal-ceramic bond,Intermetallic compound bond

Application : Specialized in reducing thickness of the sapphire substrate

The diamond grinding wheel disc for hard and brickle materials, such as new generation of mobile phone screen reinforced glass, and sapphire etc


Our sapphire substrate polishing and grinding wheel has been already well-equiped and well-performed on the UIMC grinder machine.


Performance : Our innovated metal-ceramic double ring wheel is well applied to reducing the thickness of sapphire substrate, one single side of sapphire substrate should be thinned and polished,the other side is rough,Ra0.9-1.2,for refraction.



Sharpen newly developed the diamond grinding wheel disc on CNC double end surface grinding machine makes the efficiency of the growth of more than 10 times, but also greatly reduces the cost.

By using Sharpen grinding solution, the cost of grinding for each single piece of glass is only 1.2 RMB yuan, the cost for grinding and polishing each 2”sapphire wafer or LED substrate is only 1 RMB yuan. Pour water was used during full process of grinding lead to savings on the subsequent environment cost.

We also innovates the fluting solution for sapphire wafer. However, the traditional mobile phone screen adopts laser engraving machine to slot. This method is low processing efficiency, and the rupture of sapphire could exists by the thermal stress thus will lower the product quality. The innovative Sharpen ultra-thin grinding wheel shows remarkable slotting ability in the sapphire processing technology. The thinnest slotting grinding wheel can be 0.2mm.

Meanwhile, Sharpen also developed grinding wheel for sapphire grinding on the surface grinding machine, the in feed can reach 0.05mm, which greatly reduces the equipment requirement for sapphire grinding process.


Product feature:
1.High performance of grinding and shape maintenance,
2.Free-grinding and Self-Sharpening ,Long working life ,Easy –dressing
3.Fast delivery and satisfied after-sale services.
Our grinding wheels are available to replace the internation well-known brands ,If you need any technical or service support ,Please do not hesitate to contact with us ,




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China (Mainland) | Manufacturer, Trading Company
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